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Invited Speakers
Topic I: Growth

Hiroshi Amano
Nagoya University
Low-cost Epitaxial Growth and Device Processing Technologies for Early Social Implementations of GaN-based Devices

Robert Bondokov
Crystal IS
The development and characterization of 100 mm AlN semiconductor substrates

Rafael Dalmau
HexaTech Inc.
Control of Surface Morphology and Polarity of N-Polar AlN Films Grown on AlN Bulk Substrates

James Edgar
Kansas State University
Bulk Crystal Growth of Hexagonal Boron Nitride from Molten Metal Solutions

Shota Kaneki
Sumitomo Chemical Co., Ltd.
Production-ready, high-quality GaN on GaN epitaxy by QF-HVPE up to 6”

Guangxu Ju
Peking University
In-Situ Synchrotron X-ray Studies of (In)GaN Growth Dynamics during MOVPE.

Pawel Kempisty
Institute of High Pressure Physics PAS
Ab initio thermodynamics of III-nitride semiconductor surfaces: Improving the accuracy of predictions under growth conditions

Jong Kyu Kim
Pohang University of Science and Technology (POSTECH)
Growth of hexagonal boron nitrides on non-catalytic substrates by MOCVD and their applications

Mitsuru Funato
Kyoto University
Growth integration of InGaN-based full visible LEDs

Yoshinao Kumagai
Tokyo University of Agriculture and Technology
High-speed HVPE growth of AlN homoepitaxial layers for AlN wafer fabrication

Hideto Miyake
Mie University
Deep-UV LEDs Fabricated on Face-to-Face Annealed Sputter-Deposited AlN Templates

Takafumi Odani
Mitsubishi Chemical Corporation
Impact of Dopants on the Mechanical Properties and Wafering - Behavior of GaN substrates



Topic II: Physics and Characterization

Anthony J Bennett
Cardiff University
Non-classical photon emission from point-like emitters in Aluminum Nitride

Guillaume Cassabois
Montpellier University
The carbon dimer in boron nitride

Aurelien David
Google
Disorder and the luminescence of InGaN emitters

Eva Monroy
CEA
GaN nanowires: research and application

Rachel Oliver
University of Cambridge
The role of dislocations in etching porous GaN

Michael Schnedler
Forschungszentrum Jülich GmbH
Fermi level pinning at nitride semiconductor surfaces and interfaces

Henryk Turski
Institute of High Pressure Physics PAS
Using both faces of bulk GaN substrates for functional devices

Akira Uedono
University of Tsukuba
Annealing behaviors of vacancies and their impact on dopant activation in ion-implanted GaN studied by positron annihilation

Chris Van de Walle
University of California, Santa Barbara
First-principles description of ferroelectric nitrides

H. Grace Xing
Cornell University
Fluke or Myth: A Hole Mobility of 1500 cm2/Vs in GaN (though at 4 K)

Andriy Zakutayev
National Renewable Energy Laboratory
Nitride materials with unconventional structures and semiconducting properties

Ewelina Zdanowicz
Wroclaw University of Science and Technology
Electromodulation spectroscopy of built-in electric fields in hybrid III-N heterostructures



Topic III: Optical devices

Nicolas Grandjean
École polytechnique fédérale de Lausanne (EPFL)
Origin of non-radiative point defects in InGaN/GaN quantum wells

Motoaki Iwaya
Meijo University
Low-Threshold Current (~25 mA) AlGaN-Based UV-B Laser Diodes Utilizing Refractive Index Waveguide Structures on Lattice-Relaxed AlGaN

Anna Kafar
Institute of High Pressure Physics PAS
Nitride edge emitters on 3D shaped GaN - adjustable properties and smart integration options

Ryuji Katayama
Osaka University
Far-UV Second Harmonic Generation from AlGaN-based Waveguide

Youichi Kawakami
Kyoto University
Radiative and non-radiative recombination mechanisms in red-emitting InGaN quantum wells

Susumu Noda
Kyoto University
Recent progress in photonic-crystal surface-emitting lasers (PCSELs)

Siddharth Rajan
The Ohio State University
Interband AlGaN Tunnel Junctions for Ultraviolet Emitters

Jim Speck
UC Santa Barbara
Quantitative analysis of leakage current in III-nitride micro-light-emitting diodes

Tim Wernicke
TU Berlin
Growth and analysis of UVC LEDs


Topic IV: Electronic devices

Elaheh Ahmadi
University of California Los Angeles (UCLA)
Development of N-polar GaN HEMTs fabricated on MBE-grown epi-structures on low dislocation GaN substrate

Srabanti Chowdhury
Stanford University
GaN diamond integration

William Alan Doolittle
Georgia Institute of Technology
AlN electronics for RF and power applications

Simon Fichtner
Kiel University
Ferroelectricity for a New Perspective on III-N Semiconductors

James Hwang
Cornell University
Heterogeneous Integrated Sub-THz Transceiver Front End

Martin Kuball
University of Bristol
Thermal management efforts for GaN electronic devices

Gabriel Petrus Lansbergen
Infineon Technologies Austria AG
Elevating Reliability Standards: Advanced Methodologies for HV GaN Power Devices and Systems

Farid Medjdoub
CNRS-IEMN
Advancing RF GaN HEMT Technology: Innovations in Buffer Engineering for Enhanced Performance and Robustness

Geok Ing Ng
Nanyang Technological University
RF GaN-on-Si for Future 5G/6G Communications

Jun Suda
Nagoya University
GaN-on-GaN Devices for Next Generation Electronics

Enrico Zanoni
University of Padova
Reliability & instabilities  of GaN  RF & Power devices